반도체화학공정연구실

Metal electrodeposition plays a pivotal role in fabricating metal interconnections within semiconductor devices, with the properties of these interconnections significantly impacting device performance. Our current efforts are dedicated to refining electrodeposition processes to enhance electronic device functionality. Specifically, we are concentrating on the organic/inorganic additives to achieve extreme bottom-up filling in through silicon vias (TSVs), controlling Cu microstructure for low-temperature hybrid bonding, and developing low-temperature solder materials. The growth of metal nanostructures in solution phases is influenced by additives that adsorb onto metal surfaces, thereby modulating the thermodynamics and kinetics of metal deposition. Our research focuses on understanding how these additives impact the anisotropic growth of metal nanocrystals. Moreover, leveraging this understanding, we are investigating electrodeposition techniques to fabricate metal nanostructures with precise control over their shape and dimensions. Zn aqueous batteries commonly utilize Zn foil as the anode, but they often suffer from dendritic Zn growth during cycling, which shortens their cyclability. Drawing upon our expertise in organic/inorganic additives for semiconductor metallization and nanostructure deposition, we are investigating additives aimed at controlling the morphology of Zn during cycling. Our research aims to understand how these additives interact with the Zn surface, influence Zn morphology development, and ultimately increase the cyclability of Zn aqueous batteries. Our research focuses on electrochemical processes for advanced semiconductor packaging and the fabrication of metal interconnects. Through fundamental and applied studies of electrodeposition, we dev