Laboratory of Emerging Electronics

Our research is dedicated to advancing materials, processes, and device technologies that open new frontiers in next-generation electronics through wafer-free monolithic 3D (M3D) integration of high-quality electronic components. To realize this vision, we develop innovative strategies for stacking, integrating, and assembling diverse electronic materials and devices across different functionalities, dimensionalities, and length scales, pushing the boundaries of conventional semiconductor technologies. Together, these research directions aim to establish versatile, scalable integration platforms for next-generation high-performance, high-density, and multifunctional electronic systems. The rapidly growing demand for artificial intelligence (AI) hardware calls for high-performance, highly integrated electronic devices beyond conventional scaling limits. Three-dimensional (3D) heterogeneous integration offers a promising solution by vertically stacking diverse materials and functional devices. However, conventional epitaxy, while essential for producing high-quality single-crystalline thin films, relies on thick substrates that fundamentally constrain integration density and architectural flexibility. To overcome these limitations, we develop advanced epitaxy platforms for freestanding single-crystalline membranes spanning a broad range of functional materials, including elemental and compound semiconductors, complex oxides, and emerging quantum materials. By leveraging two-dimensional (2D) interlayers, nanoscale patterning, and engineered interfacial interactions, we enable the growth and release of high-quality crystalline membranes with minimal defects. Freed from substrate-induced constraints, these membranes offer enhanced material functionalities and unprecedented f