전력전자 연구실

Power electronics can be found wherever there is a need to modify a form of electrical energy (i.e. change its voltage, current or frequency). The power range of these systems is from some milliwatts (as in a mobile phone) to hundreds of megawatts (e.g. in a HVDC transmission system). With "classical" electronics, electrical currents and voltage are used to carry information, whereas with power electronics, they carry power. In modern systems, power electronics is performed with semiconductor switching devices such as DIODEs, MOSFETs, and IGBTs. In contrast to electronic systems for processing of signals and data, power electronics processes substantial amounts of electrical energy. Thus, the most important performance of power electronics becomes the efficiency. Next-generation power module packaging technologies are investigated to achieve high efficiency and reliability in high-power-density power conversion systems. Parasitic inductance and capacitance in power loops are precisely analyzed, with a focus on developing low-parasitic packaging structures that minimize their impact on switching performance. Low-inductance packaging structures based on die-embedded PCBs are designed and optimized in terms of both electrical and thermal performance. In addition, parasitic analysis and reduction techniques for WBG-based intelligent power modules (IPMs) are explored to enable high-frequency, high-efficiency power conversion. This research covers the modeling, design, and control of modular multilevel converters (MMCs) for MVDC/HVDC power conversion systems. Advanced control algorithms are developed to ensure stable and efficient system operation, while system dynamics and stability are analyzed under various grid and operating conditions. Cybersecurity is also addressed thr